Polishing Diamond Abrasive Powder 0.5μM - 60μM Size For Abrasive Refractory Industry

Diamond wire special powder

Product features: raw materials used in high technology, high strength of high-quality diamond, through special processing procedures, product crystal form is more regular, the particle size distribution is very concentrated, effective grinding particle concentration, high powder particle strength, low impurity content, with good dispersion, wear resistance.

Usage: suitable for cutting, grinding and polishing of organic and inorganic brittle materials.Such as: wire saws, wire saws, gem saw blades, semiconductor saw blades and other cutting tools, but also for single crystal silicon, polycrystalline silicon, diamond, gemstone, Sapphire, Quartz plate, LED sapphire substrate, liquid crystal glass, high-precision magnetic materials, semiconductor and other high-tech materials, coarse grinding, fine grinding, polishing tools.

fine abrasive powder

synthetic diamond grit

Polishing Diamond Abrasive Powder 0.5μM - 60μM Size For Abrasive Refractory Industry Images